Green Advanced Technology
Product
Functional powder and paste
Conductive polymer powder
Low-density functional powder that imparts conductivity by coating various conductive metals
on the surface of non-conductive polymer particles
Product Use
- Conductive adhesive tape
- Conductive adhesive
- EMI Shielding material
Product Characteristics
- Low density compared to metal powder
- Good conductivity
- High Reliability
Properties
CATEGORY
제품군
PRODUCT
입자크기(D50, ㎛)
탭밀도(g/cc)
코팅 함량
Hollow
Ni coated polymer
EN-NPH 100
13±2
0.9~1.1
60~80%
Hollow
Ni coated polymer
EN-NPH 200
25±3
0.5~0.7
60~80%
Hollow
Ni coated polymer
EN-NPH 300
32±3
0.2~0.4
60~80%
Hollow
Ni coated polymer
EN-NPH 600
65±5
0.2~0.3
60~80%
Hollow
Ag coated polymer
EN-SPH 100
13±2
0.7~0.8
50~60%
Hollow
Ag coated polymer
EN-SPH 200
25±3
0.2~0.3
60~70%
Flake
Ni coated polymer
EN-NPF 150
18±2
0.9~1.1
60~80%
Flake
Ag coated polymer
EN-SPF 150
16±2
0.4~0.6
50~60%
Flake
Ag/Ni coated polymer
EN-SNPF 150
17±2
0.9~1.1
10~20%(Ag) / 60~80%(Ni)
Flake
Ag/Cu coated polymer
EN-SCPF 150
16±2
1.0~1.1
10~20%(Ag) / 60~70%(Cu)
Conductive metal powder
Functional powder with improved oxidation resistance
and conductivity by coating Ag on the surface of Cu and Ni particles
Product Use
- EMI shielding material
- Heat dissipation material
- Conductive silicone
- Conductive paste
- Replacement of expensive Ag powder
Product Characteristics
- Good conductivity
- High Reliability
- Uniform dispersibility
Functional cermaic powder
Functional powder with improved physical properties and reliability compared to just mixed products
by coating ceramic powder with various elements at the same time
Product Use
- MLCC dielectric materials
- Secondary battery cathode active material
- Insulation of metal powder
Product Characteristics
- Simultaneous coating of multiple elements (Ba, Mg, Ca, Ti, V, Si, etc.)
- Nano powder coating available
- Various compositions and contents can be adjusted according to customer needs
Core technology
TEM
TEM-EDS
Conductive polymer powder
Low-density functional powder that imparts conductivity by coating various conductive metals
on the surface of non-conductive polymer particles
Product Use
- Conductive adhesive tape
- Conductive adhesive
- EMI Shielding material
Product Characteristics
- Low density compared to metal powder
- Good conductivity
- High Reliability
Properties
CATEGORY | 제품군 | PRODUCT | 입자크기(D50, ㎛) | 탭밀도(g/cc) | 코팅 함량 |
---|---|---|---|---|---|
Hollow | Ni coated polymer | EN-NPH 100 | 13±2 | 0.9~1.1 | 60~80% |
Hollow | Ni coated polymer | EN-NPH 200 | 25±3 | 0.5~0.7 | 60~80% |
Hollow | Ni coated polymer | EN-NPH 300 | 32±3 | 0.2~0.4 | 60~80% |
Hollow | Ni coated polymer | EN-NPH 600 | 65±5 | 0.2~0.3 | 60~80% |
Hollow | Ag coated polymer | EN-SPH 100 | 13±2 | 0.7~0.8 | 50~60% |
Hollow | Ag coated polymer | EN-SPH 200 | 25±3 | 0.2~0.3 | 60~70% |
Flake | Ni coated polymer | EN-NPF 150 | 18±2 | 0.9~1.1 | 60~80% |
Flake | Ag coated polymer | EN-SPF 150 | 16±2 | 0.4~0.6 | 50~60% |
Flake | Ag/Ni coated polymer | EN-SNPF 150 | 17±2 | 0.9~1.1 | 10~20%(Ag) / 60~80%(Ni) |
Flake | Ag/Cu coated polymer | EN-SCPF 150 | 16±2 | 1.0~1.1 | 10~20%(Ag) / 60~70%(Cu) |
Conductive metal powder
Functional powder with improved oxidation resistance
and conductivity by coating Ag on the surface of Cu and Ni particles
Product Use
- EMI shielding material
- Heat dissipation material
- Conductive silicone
- Conductive paste
- Replacement of expensive Ag powder
Product Characteristics
- Good conductivity
- High Reliability
- Uniform dispersibility
Functional cermaic powder
Functional powder with improved physical properties and reliability compared to just mixed products
by coating ceramic powder with various elements at the same time
Product Use
- MLCC dielectric materials
- Secondary battery cathode active material
- Insulation of metal powder
Product Characteristics
- Simultaneous coating of multiple elements (Ba, Mg, Ca, Ti, V, Si, etc.)
- Nano powder coating available
- Various compositions and contents can be adjusted according to customer needs
Core technology
TEM
TEM-EDS